COMS - 幫浦鑄造

幫浦鑄造

Bump Coining MC

精密伺服壓力機設備，實現一致

尺寸、高度和共面性，用於翻轉芯片焊料凸起

半導體封裝基板,通過控制半導體封裝基板 熱和壓力

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Company Name : CO-MS

Address: 77, Gongdan-ro 98beon-gil, Heungdeok-gu, Cheongju-si,Chungcheongbuk-do, Republic of Korea

KoreaPhone : +82-43-212-22577

Website: http://www.co-ms.co.kr/en/